yakex
Junior Member level 3
positive copper plane and thermal pad in cadence 16.3
For each layer of the padstack you can define a regular pad, an antipad, and a thermal pad.
I have a question: if the padstack passes through a positive plane and the pin or via using the padstack needs to be connected to the plane, what will be used then? regular pad? or thermal pad?
The following are well known to everyone.
1. In the printed circuit board design, Allegro uses the regular pad definition for a padstack when the padstack does not pass though a copper plane on a layer.
2. For a negative plane, if the padstack passes through a plane and the pin or via using the padstack needs to be connected to the plane, then the thermal definition is used.
3. If the padstack passes through a plane and the pin or via using the padstack does not need to be connected to the plane, then the anti-pad definition is used.
For each layer of the padstack you can define a regular pad, an antipad, and a thermal pad.
I have a question: if the padstack passes through a positive plane and the pin or via using the padstack needs to be connected to the plane, what will be used then? regular pad? or thermal pad?
The following are well known to everyone.
1. In the printed circuit board design, Allegro uses the regular pad definition for a padstack when the padstack does not pass though a copper plane on a layer.
2. For a negative plane, if the padstack passes through a plane and the pin or via using the padstack needs to be connected to the plane, then the thermal definition is used.
3. If the padstack passes through a plane and the pin or via using the padstack does not need to be connected to the plane, then the anti-pad definition is used.