PCB Design for the Spartan-3E FG320 BGA

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letrongdtk4

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Hi all,

I have a PCB design for the Spartan-3E FG320 BGA in attach file.

1, Can you see schematic and send to me your remark ?

2, I will design PCB 4 layer.

- Stackup :
+ TOP (Signal1)
---------------------- 9 mil ------------------------------------------------------
+ GND Plane
----------------------- 50 mil -----------------------------------------------------
+ Power + Signal1
------------------------ 9mil ------------------------------------------------------
+ BOTTOM(Signal 2)

- Via Pad Diameter : 0.6mm
- Via Pad Hole : 0.3 mm
- Wide traces and space( inter-ball Area ) : 5 mil
- Wide trace and space (package outer) : 6 mil
- Power supply trace : 50 mil
- Based copper thickness : 1 oz (~ 34.3 um)


Then, i caculator the parameter from link : https://www.skottanselektronik.com/

My PCB manufacture is FAB-9 : https://fab-9.com/web/content/view/14/28/
All rule is true.

But, time the firt i design PCB multi layer.
I want to hear your advice

Thanks,
 

Attachments

  • MS.pdf
    1.2 MB · Views: 86



Hi,

Thank for your help.

1, I have reviewed.
I use separate module power supply.
I have edited the attachments.

2, i will read application you send.
I i have problem.
I will tell you.

Thanks,
 

Attachments

  • MS_S3EDECOUPLING.pdf
    260.5 KB · Views: 79

Yaa now it makes a sense as in the last pdf I some how get the fell that your 3.3 v was connected to VCCINT....

Good Luck
 

Yaa now it makes a sense as in the last pdf I some how get the fell that your 3.3 v was connected to VCCINT....

Good Luck

Hi,

Sorry, i forgot to send file.

Can you tell me more detail

Thanks,
 

Attachments

  • MS_S3EDECOUPLING.pdf
    260.5 KB · Views: 76
Last edited:

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