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package simulation in ADS

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morfozar

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Hello!

Did anyone use QFN Package design kit, that is included in ADS? Also there are package design kits from Amkor and STATSChipPAC with only QFN packages.
Is result good in comparasion with real measurement? And is that technique fit to other packages, SOT for example?
I'm asking because it was designed in 2011 year and since this date I did'n find any other package design kits. There is no comparasion with real measurement and I think that port definition inside package from chip pads to package pads is hard because there is no good ground reference.
 

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