covcst
Member level 2

Hi everybody,
I am new to RF measurement at wafer level and a little bit confused regarding the de-embedding procedure using open pad deembedding for a 1 port network using a network analyzer.
What I have learnt is as follows:-
1. Get the S11 parameter of the device with the GSG pads.
2. Get the S11 parameter of the open pad GSG structure.
3. Convert both the S11 parameters to their respective Y11 parameters.
4. Y11(device only) = Y11(device with GSG pad) - Y11(only GSG pads).
5. Convert the Y11(device only) to its S11(device only).
6. Get the smith chart of the device characteristics itself....
Someone plz tell me whether I have understood it correctly, if I'm wrong please rectify me......
I am new to RF measurement at wafer level and a little bit confused regarding the de-embedding procedure using open pad deembedding for a 1 port network using a network analyzer.
What I have learnt is as follows:-
1. Get the S11 parameter of the device with the GSG pads.
2. Get the S11 parameter of the open pad GSG structure.
3. Convert both the S11 parameters to their respective Y11 parameters.
4. Y11(device only) = Y11(device with GSG pad) - Y11(only GSG pads).
5. Convert the Y11(device only) to its S11(device only).
6. Get the smith chart of the device characteristics itself....
Someone plz tell me whether I have understood it correctly, if I'm wrong please rectify me......