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On die termination VS on board termination

henry kissinger

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I made transient simulations between on die termination (termination is after the wire bond) VS on board termination (termination is before the wire bond).
The result shows that the termination after the wire bond performs better with less ringing.

Does anyone know how to explain this phenomenon in simple words? I hope we are not getting into mathematical details. I prefer a conceptual explanation.
Thank you!!!

1669795705078.png
 

dick_freebird

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A little L and R are helping mellow out the C-dominated package parasitics which make you Z=50 into Z=(50+"stuff").

Bearing in mind that simple package and tline models are just that....
 

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