Oct 25, 2011 #1 P pavel_adameyko Full Member level 4 Joined Jun 23, 2010 Messages 190 Helped 52 Reputation 104 Reaction score 37 Trophy points 1,308 Location Belarus Activity points 2,338 Hello, friends) Which tool i can use to extract spice model for BGA package? I suppose any 3D EM solver would work. For example, Sonnet. Am i wrong? Have anybody already modelled BGA package? Can you share your experience... Thanks for advance
Hello, friends) Which tool i can use to extract spice model for BGA package? I suppose any 3D EM solver would work. For example, Sonnet. Am i wrong? Have anybody already modelled BGA package? Can you share your experience... Thanks for advance
Oct 25, 2011 #2 cks3976 Full Member level 6 Joined Aug 8, 2007 Messages 344 Helped 84 Reputation 168 Reaction score 81 Trophy points 1,308 Location India Activity points 3,324 IMO you cannot extract the Spice model of a footprint such as BGA. Spice model is more device dependent and so is IBIS model.
IMO you cannot extract the Spice model of a footprint such as BGA. Spice model is more device dependent and so is IBIS model.
Oct 25, 2011 #3 P pavel_adameyko Full Member level 4 Joined Jun 23, 2010 Messages 190 Helped 52 Reputation 104 Reaction score 37 Trophy points 1,308 Location Belarus Activity points 2,338 Why i cann't do EM simulation of BGA package, extract s-parameters and create broadband spice model like that Sonnet creates.
Why i cann't do EM simulation of BGA package, extract s-parameters and create broadband spice model like that Sonnet creates.