My pcb layout, any suggestion?

[zsuhh]

top layer:


bottom layer:

 

[andre_luis]

Seems as clearance defined to ground plane is quite small, particularly close to components Pads, which eventually could have a solder drop spreading beyond their unmasked region.




+++

 

[KlausST]

Hi,

Thermals are switched off. This makes soldering by hand difficult.

Klaus

 

[rube]

1\Shape thermal relief orthogonally connects to SMT pins, through pins, that would be best;
2\Shape clearance in the range of 0.3~0.5MM is perfect;
3\you can use thick lines, big vias. to save costs

 

[zsuhh]

The clearance is 6 mil between lines and shapes. For soldering, it is no problem. I have soldered a lot this kind of boards by hand.

 

[KlausST]

The clearance is 6 mil between lines and shapes. For soldering, it is no problem. I have soldered a lot this kind of boards by hand.

Thermals are the gaps to the signal plane connections. You don't use it. Be sure this is what you want.

Klaus

 

[zsuhh]

Hi guys, thank you so much.

I have changed the design as folllows;
(1) Thermal relief connect setting: Thru pins: Diagonal; Smd pins : Orthogonal; Vias: Full contact;
(2) I have checked the BBB design. It's clearance between lines and shape is 5mil. So I might keep mine as 6mil.
(3) The line's and visa's size already match the pcb factory's minimal requirement. If I increase them, it still not save money. Anyway, still thank rube so much for your valuable suggestion.