ccao
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Hello, I saw Hobbss to help someone for Allegro via configuration 49 months ago. Hobbss also mentioned to create multiple vias in that threads, it was long time ago. Hope Hobbss can see my threads or some other experts can help me.
I am doing layout for BGA162 package(it is 0.5mm pitch). I need 2 different via to make trace connection. One is 0.15mm drill 0.30mm pad(is this pad too small? because of the spacing limitation_0.08mm spacing, I can't increase the via pad)) for BGA ball tracing and the other is 0.2mm dill 0.50mm pad for other parts tracing. Please help me to configure these 2 vias.
Thanks.
ccao
I am doing layout for BGA162 package(it is 0.5mm pitch). I need 2 different via to make trace connection. One is 0.15mm drill 0.30mm pad(is this pad too small? because of the spacing limitation_0.08mm spacing, I can't increase the via pad)) for BGA ball tracing and the other is 0.2mm dill 0.50mm pad for other parts tracing. Please help me to configure these 2 vias.
Thanks.
ccao