juz_ad
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It seems to be accepted that a large ground plane/copper pour helps with PCB heat dissipation.
I understand the idea that more mass will help dissipate/distribute heat…
…but why the ground plane? It seems more intuitive that the power rails would be where most of the heat was being produced?
Can anyone explain the relationship between the ground plane size and the generation/dissipation of heat on a PCB?
Thank you!
I understand the idea that more mass will help dissipate/distribute heat…
…but why the ground plane? It seems more intuitive that the power rails would be where most of the heat was being produced?
Can anyone explain the relationship between the ground plane size and the generation/dissipation of heat on a PCB?
Thank you!