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pcb with surface mount or wirebonded components on top. Probably combination boards, with digital parts on FR4, and microwave parts on rogers type materials bonded to the same FR4. then assembly into housings. frequencies to maybe 28 GHz.
the portions I need to cover are the release from engineering to manufacturing, and all the things a modern microwave manufacturing cell would want to have set up. such as testability designed in, the right types of test equipment, screening, sample plans/material control, design centering, assembly methods, etc.
I can fill in the details, but I need checklists, or example procedures to spark my memory, or to remind me of things I might forget to list.