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TMM® Temperature Stable Microwave Laminates
(Thermoset ceramic loaded plastic)
TMM substrates, TMM 3 (er =3.27), TMM 4 (er =4.5), TMM 6 (er =6.0), TMM 10 (e r =9.2) and TMM 10i (e r =9.8), combined the best of the ceramic and PTFE substrate world. Introduced in the early 1990’s, TMM materials provided a rigid substrate to which device attachment could be easily done, as well as providing a substrate that could be manufactured using conventional printed circuit board techniques unlike the expensive processing of pure thin film high purity alumina. Like the RT/duroid 6002 material, TMM thermal properties were well matched so as to have stable electrical and mechanical performance. With a wide variety of dielectric constants, these substrates can be used in space applications, particularly microstrip patch antennas.
RO3000® and RO3200™ series High Frequency Laminates -
The first of a series of commercial products (early 1990’s), the RO3000® materials family consists of three grades, RO3003™ (er =3.0), RO3035 ( er r= 3.50), RO3006 (er =6.15) and RO3010 (er =10.2) laminate. These materials combine microwave frequency electrical properties and improved temperature stable performance at a fraction of the cost of it’s military grade counterparts (RT/duroid 6000 laminate). With a CTE matched to that of copper and FR4 in the X-Y plane, RO3000/FR4 hybrid constructions can be fabricated reliably. The RO3003 can be used at relatively high frequencies because of its low dielectric loss (tan d =0.0013 @ 10 GHz).
RO3200 laminate family is made up of RO3203 (e r =3.02) and RO3210 (er =10.2) materials, developed for applications where RO3000 materials are suited but require a material with greater mechanical strength. RO3200 materials are made by combining PTFE/ceramic layers with PTFE/woven glass for added rigidity. Like RO3000 materials, this family is also suited for MLB’s and hybrid constructions with FR4.