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Without "reticle stitching" you are limited to the reticle dimension (as scaled by the optics, commonly 10X) which tends to be about 20mm. I have seen some cases where a 20mm field has to be reduced for depth-of-field / astigmatism litho issues, the physical field on-wafer is a best case.
Without "reticle stitching" you are limited to the reticle dimension (as scaled by the optics, commonly 10X) which tends to be about 20mm. I have seen some cases where a 20mm field has to be reduced for depth-of-field / astigmatism litho issues, the physical field on-wafer is a best case.
What's your meaning of low technology (180nm, 130nm, 90nm)?
The reticle size usually is 26mm*33mm. Due to scrible-line, the maximum die size should be less than it.
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