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Maximum die size

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fragnen

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What is the maximum die size that is possible in lower technology nodes?
 

dick_freebird

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Without "reticle stitching" you are limited to the reticle dimension (as scaled by the optics, commonly 10X) which tends to be about 20mm. I have seen some cases where a 20mm field has to be reduced for depth-of-field / astigmatism litho issues, the physical field on-wafer is a best case.
 

fragnen

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Without "reticle stitching" you are limited to the reticle dimension (as scaled by the optics, commonly 10X) which tends to be about 20mm. I have seen some cases where a 20mm field has to be reduced for depth-of-field / astigmatism litho issues, the physical field on-wafer is a best case.
Do you want to mean that the maximum die size that is possible in lower technology nodes is 20 x 20 mm2.
 

littlej_zju

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What's your meaning of low technology (180nm, 130nm, 90nm)?
The reticle size usually is 26mm*33mm. Due to scrible-line, the maximum die size should be less than it.
 

dpaul

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You must define what are "lower technology nodes" to get a proper answer.
This is a technical question in a technical forum.
 

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