Layer Stack for best EMC

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Inka_One

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Hi Folks!

I wanna know how the layer stack below could help me with EMC/EMI:

1st Layer - Gnd
2nd Layer - Signal/Pwr
3th Layer - Signal/Pwr
4th Layer - Gnd

or

1st Layer - Pwr
2nd Layer - Signal
3th Layer - Signal
4th Layer - Gnd

Please! I need a explanation how this setup of layer stack can help me with EMC/EMI.

Best regards for all!
 

Hi Inka,


The both are OK from my humble opinion. PWR/GNDs at outside layer are always the best for shielding purposes, but reworking of board would be be very difficult in this case. For radiating, it is important to keep paths to GND quite short. Then signals layers should be close to GND layer.

Surely different applications (e.g. high-speed data comm, power electronics, RF) have different priorities. You should keep them in your consideration.

Actually there are some nice notes about PCB layering techniques. Some of them are populated below.

http://www.icd.com.au/articles/Stackup_Planning_AN2011_2.pdf

http://www.hottconsultants.com/techtips/pcb-stack-up-1.html

http://www.hottconsultants.com/techtips/pcb-stack-up-1.html

Hope it helps.

Cheers
 

I think the best option is to use Pwr/Signal/Signal/Gnd to keep the paths between GND Plane and signal layers as short as possible.

Do you agree with me?

Best Regards!

 

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