orient
Newbie level 4
Hi there,
I am working on large ASIC design with approximately 40k gates, including 10k flop-flops. The design has mostly a single clock, except for some other smaller clock domains (JTAG's TCK, etc).
I have already fully tapeout and tested other digital-on-top ASICs on the same technology (0.18um CMOS), but this time, I am much worried about the clock signal that has to clock these 10k registers. Also, there are some mixed-signal blocks on the same chip, I want to keep my power lines as clean as possible.
The price I am willing to pay is a lot of VDD/GND pads. I can have as much as possible, as long as it remains reasonable. I still need to use a 128-pin package eventually, and a fraction of these pads are already taken.
Does anyone know how I could estimate the number of VDD/GND pads I need to use for a given switching-noise figure?
What worries me too, is that the same design consumes a large chunk of a Cyclone III FPGA device (85% of a EP3C55). But that FPGA device has a huge number of power pads and its package uses flip-chip technology, so the decoupling caps are very close to the chip. Am I heading toward a disaster?
Please, any ideas and comments would be highly appreciated.
I am working on large ASIC design with approximately 40k gates, including 10k flop-flops. The design has mostly a single clock, except for some other smaller clock domains (JTAG's TCK, etc).
I have already fully tapeout and tested other digital-on-top ASICs on the same technology (0.18um CMOS), but this time, I am much worried about the clock signal that has to clock these 10k registers. Also, there are some mixed-signal blocks on the same chip, I want to keep my power lines as clean as possible.
The price I am willing to pay is a lot of VDD/GND pads. I can have as much as possible, as long as it remains reasonable. I still need to use a 128-pin package eventually, and a fraction of these pads are already taken.
Does anyone know how I could estimate the number of VDD/GND pads I need to use for a given switching-noise figure?
What worries me too, is that the same design consumes a large chunk of a Cyclone III FPGA device (85% of a EP3C55). But that FPGA device has a huge number of power pads and its package uses flip-chip technology, so the decoupling caps are very close to the chip. Am I heading toward a disaster?
Please, any ideas and comments would be highly appreciated.