Some of ADI DDS chips are SSOP (0.65 mm spacing), newer are MSOP or QFN (0.5 mm). I'm used to solder these devices by hand for prototyping, and I know several electronic companies, where even small series are soldered "pin-by-pin" (up tp 240 pin PQFP FPGAs). But for soldering complete boards, I prefer solder paste and a hot plate (e.g. in the kitchen). Also a small electrical "pizza" oven is fine. A hot air gun is good for rework, but involves a certain risk to overheat PCB and parts, and also blowing away small ones.