I take your point about the 130degC.
I like the idea of a pad, since especially if it was slightly bigger than the PCB, then we could be sure the back of the PCB is well covered, rather than glue where who knows if the assemblers have pasted it fully over the back of the PCB.
These LED PCB's stand vertically up against a flat aluminium heatsink, and we glue them to that with the Loctite 435, then the two solder points are soldered at the bottom of the LED PCB, so that the LED PCB is electrically contacted to the Driver PCB.
.......it worries me that if we use a pad, then as the solder cools, it may kind of force the PCB away from the vertical aluminium post, such that the pad also becomes ripped away from the aluminium post....but this may or may not be realisitic?
.(..a similar phenomenon is that of tomb-stoning, where cooling solder stands chip resistors vertically like tombstones)