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When you say "design" do you mean simply demonstrate,
or optimize to the foundry's capability and the application
you anticipate? Anybody can make a poly rectangle cross
a thin-oxide cut and lay N+ or P+ over it and sink a
contact on both ends. This is the trivial part. Modern
MOS devices have much subsurface detail which has
to do with both mask layers (sometimes Boolean and not
seen by the designer) and process (angled implants, hard
masking spacers, etc.).
So just what do you think you're "designing" here?