Welcome to our site! EDAboard.com is an international Electronics Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.
It appears that connections (2) are already made by some
sort of post-foundry lithography (maybe thick film metal dep
and etch).
I wonder whether this is in fact an RFID, or perhaps only an
anti-theft tag (which only needs a diode punched out to
eliminate its harmonics generation). The chip looks pretty
small to have a radio and product code memory on it. But
it's been a decade or more since I looked at RFID state of
the art.
Wire bond is your other alternative but that may mess
with the RF attributes, depending on frequency band
and the matching of the printed antenna (half a loop
of bondwire inductor at each end, vs the shown planar
short taper).
For just messing around, a minuscule dot or highly conductive
epoxy with 1-mil gold wire might serve. Place the dots with
a microprobe and a needle that's "expendable" maybe.
Push the wire segments around with the micromanipulator &
a clean needle until they stick right. This all would care a
lot about bond pad finish and any post-fab oxide growth,
which may be an effective insulator (ball or wedge bond
ultrasonic scrub breaks up pad oxidation, if it's not heinous;
epoxy glob will not, you might want to scrub a bit with the
probe tip as you drop the glob in the pad window).
If you lay the wires flat (rather than looped, as wire bonders
will) that would minimize added L.
This site uses cookies to help personalise content, tailor your experience and to keep you logged in if you register.
By continuing to use this site, you are consenting to our use of cookies.