alexan_e
Administrator
Hi
My new hot air rework station just arrived (ATTEN858D+), it has digital temperature setting 100-450 degree Celsius and an analog potentiometer for air speed.
It has 3 nozzles 10, 7 and 4mm diameter.
I'm currently using the thinnest for smd chips.
My question is which temperature should i use to desolder a chip?
for example a 64 or 100 pin square qfp.
I assume i should use the lowest possible that can still melt the joints to dessolder so that the ic doesn't overheat.
Also about the air speed, is the lowest setting the best (so that you don't overhead other components in the pcd ) ?
I'm thinking maybe a low air speed will not transfer as much heat as a higher speed.
I would appreciate any suggestion or link to guides about proper settings.
Thank you
Alex
My new hot air rework station just arrived (ATTEN858D+), it has digital temperature setting 100-450 degree Celsius and an analog potentiometer for air speed.
It has 3 nozzles 10, 7 and 4mm diameter.
I'm currently using the thinnest for smd chips.
My question is which temperature should i use to desolder a chip?
for example a 64 or 100 pin square qfp.
I assume i should use the lowest possible that can still melt the joints to dessolder so that the ic doesn't overheat.
Also about the air speed, is the lowest setting the best (so that you don't overhead other components in the pcd ) ?
I'm thinking maybe a low air speed will not transfer as much heat as a higher speed.
I would appreciate any suggestion or link to guides about proper settings.
Thank you
Alex