SMT Resoldering Revisted
I also use one similar tool, and it works perfectly. All you need is some experience. When desoldering such ICs with small pads, you have to pull it very, I mean VERY gentle. If you pull it before the soldering material is completely melted on all pads, you will damage the pads, because their adhesion to substrate is much lower due to temperature. Also, you have to take care not to overheat the board, because you will fry it, and if it is a 4 or more layer board, you can delaminate the layers or damage the vias in the heated areas. Damaging the vias is the worst thing, because it will not be visible. Take some unused boards with such ICs on them and practice. I reccomend to set the air speed at minimum, because a high air speed can blow small components away (like R and C in small forms - 0603, 0805 or SOT-23).
/pisoiu