The analog circuitry was placed in a corner on the board specifically to avoid digital ground currents. There is a solid ground plane (no split ground) covering the board. It's also nailed down to chassis ground by 2 screws in the vicinity. The analog part has it's own power supplies which are low noise LDO's and the most sensitive part (24 bit ADC over 50 millivolts) is enclosed in a shield box. I'm quite aware of the general guidelines.
I poured both the bottom and top layer around the analog area and stitched both pours heavily to the internal ground plane. Regarding the top and bottom pouring, i'm wondering if there are any things i need to be aware of negatively affecting EMC performance (other then dead copper).