givi
Newbie level 4
Hello,
I'm facing a challenge in upgrading my manufacturing process. Could anyone who has experience comment on the steps in my process and how they think it should be modified.
Process
starting with a bare FR-4 double sided laminate)
- Drill board with CNC machine
- Through hole plate the board
- Apply Positive photoresist using dip coating (concerned about how effective through hole plated vias are covered and protected by resist)
- Expose and develop using positive image with image pads filled
- Cut the board to size
- Soldermask using photo-image-able soldermask (apply using screen printing)
- Apply Index using photo-image-able indexmask (apply using screen printing)
Sincerely
Givi
I'm facing a challenge in upgrading my manufacturing process. Could anyone who has experience comment on the steps in my process and how they think it should be modified.
Process
starting with a bare FR-4 double sided laminate)- Drill board with CNC machine
- Through hole plate the board
- Apply Positive photoresist using dip coating (concerned about how effective through hole plated vias are covered and protected by resist)
- Expose and develop using positive image with image pads filled
- Cut the board to size
- Soldermask using photo-image-able soldermask (apply using screen printing)
- Apply Index using photo-image-able indexmask (apply using screen printing)
Sincerely
Givi