you said with thes working papar
G. Hebermehl, F.-K. Hubner, R. Schlundt, T. Tischler,
H. Zscheile, W. Heinrich, ,,Perfectly Matched Layers in Transmission
Lines, Numerical Mathematics and Advanced Applications,\ ENUMATH
2001, 281 { 290, Springer Verlag, 2003.
G. Hebermehl, F.-K. Hubner, R. Schlundt, T. Tischler,
H. Zscheile, W. Heinrich, ,,Numerical Simulation of Lossy Microwave
Transmission Lines Including PML,\ Scienti_c Computing in Electrical
Engineering, Lecture Notes, 267 { 275, Springer Verlag, 2001.
T. Tischler, M. Rudolph, A. Kilk, W. Heinrich, ,,Via Arrays
for Grounding in Multilayer Packaging { Frequency Limits and Design
Rules,\ IEEE International Microwave Symposium Digest, vol. 2, 1147
{ 1150, 2003.
Added after 43 seconds:
G. Hebermehl, F.-K. Hubner, R. Schlundt, T. Tischler,
H. Zscheile, W. Heinrich, ,,Perfectly Matched Layers in Transmission
Lines, Numerical Mathematics and Advanced Applications,\ ENUMATH
2001, 281 { 290, Springer Verlag, 2003.
G. Hebermehl, F.-K. Hubner, R. Schlundt, T. Tischler,
H. Zscheile, W. Heinrich, ,,Numerical Simulation of Lossy Microwave
Transmission Lines Including PML,\ Scienti_c Computing in Electrical
Engineering, Lecture Notes, 267 { 275, Springer Verlag, 2001.
T. Tischler, M. Rudolph, A. Kilk, W. Heinrich, ,,Via Arrays
for Grounding in Multilayer Packaging { Frequency Limits and Design
Rules,\ IEEE International Microwave Symposium Digest, vol. 2, 1147
{ 1150, 2003.
:|
Added after 1 minutes:
you said with thes working papar
G. Hebermehl, F.-K. Hubner, R. Schlundt, T. Tischler,
H. Zscheile, W. Heinrich, ,,Perfectly Matched Layers in Transmission
Lines, Numerical Mathematics and Advanced Applications,\ ENUMATH
2001, 281 { 290, Springer Verlag, 2003.
G. Hebermehl, F.-K. Hubner, R. Schlundt, T. Tischler,
H. Zscheile, W. Heinrich, ,,Numerical Simulation of Lossy Microwave
Transmission Lines Including PML,\ Scienti_c Computing in Electrical
Engineering, Lecture Notes, 267 { 275, Springer Verlag, 2001.
T. Tischler, M. Rudolph, A. Kilk, W. Heinrich, ,,Via Arrays
for Grounding in Multilayer Packaging { Frequency Limits and Design
Rules,\ IEEE International Microwave Symposium Digest, vol. 2, 1147
{ 1150, 2003.