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DFM Spec for Component Placement

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prasguy

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Hi All,

There is any guidelines available for component placement in pcb with respect to Design for Manufacturing(DFM)?

what and all precautions need to be taken care during component placement w.r.t DFM and if there any materials available. Kindly pass it on.

Regards
Pr
 

marce

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Start with this document:
http://www.dnu.no/arkiv1/The CAD Library of the Future.pdf

One of the more crucial component placement issues can be MLCC capacitors as mentioned in this document:
http://www.digikey.com/Web Export/Supplier Content/TDK_445/PDF/TDK_cracking.pdf?redirected=1
I.e. depending on the chosen PCB de-panelisation method can determine where you place MLCC's and other critical components.

Then you will have to look at the signal integrity, EMC and thermal issues with regard to your component placement.
I would categerize the choices as:
1. Critical placement issues, height restrictions etc; these issues would make the board impossible to assemble so have to be catered for.
2. Electrical (signal integrity) issues, place components with regard to electrical function, using any fixed component positions (eg connectors) as a nucleus for the related circuitry.
3. Special care is required if you have components that could cause thermal issues.
All the issues have to be considered in unison, and there are others, but this should give you a start. The aim is to create a board that can be assembled, tested and works.
Have Fun.
Themal placement:
Flomerics Presentation at DesignCon:
http://namcub.accela-labs.com/pdf/O... of heat generating electronic components.pdf
 

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