Hello, I have QPA2575n amplifier as shown bellow.
I want to build a microstrip power devider and plug them together.
I am used to build microwave systems on a single substrate layers but here i need to design my power divider on a substrate level shown below.
My question is when is what substrate do i use for my microwave power divider design?
What copper thickness should i use ?
Also i incorporate VIA fense form my microwave divider,What layers will my VIA fence go threw?
Thanks.
This is easy. If you google material properties for 370HR and Rogers 6202 dielectrics, you will notice that the Rogers material has much lower dielectric loss. So that is the dielectric to use for your RF design, with Metal1 for routing and Metal2 as the ground plane.