Universal tool - scalpel. Be careful cutting tracks.
I tend to use a scalpel to lift up a pin too - the scalpel is thin and narrow enough to manipulate close to the IC,
yet strong enough to lift up a SMD IC pin (SOIC, TQFP, etc), once you've melted the solder.
You don't need to put anything under the pin, just solder a very light wire to it, and the pin will support it,
without any padding/support, for test boards. The wire to use is the (approx)30AWG tefzel/kynar coated types.
Sometimes I will use some small dab of epoxy resin to secure the wire, for test boards.