Newbie level 2
I've been designing boards for a system that inherently generates A LOT of EMI (very high pulsed power application). We always have issues with noise coupling onto our small signals, so on the boards I've been designing I have been putting copper pours on the top and bottom layers after all the routing is finished and connecting those pours to the chassis of our system. My initial thought was that those pours would provide a some level of shielding to the signals on the board, but I wonder now if maybe they are doing more harm than good as we sometimes experience 'ground bounce' during our high energy pulsing. I wonder if maybe I'm inducing more noise onto my signals by placing this fill next to them. Any thoughts on this or pointers in general on placing planes or pours/fills?