Continue to Site

Welcome to EDAboard.com

Welcome to our site! EDAboard.com is an international Electronics Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.

CMOS LNA design Lg bond wire

Status
Not open for further replies.

anutarang

Newbie level 2
Joined
Nov 19, 2008
Messages
2
Helped
0
Reputation
0
Reaction score
0
Trophy points
1,281
Activity points
1,295
lg bond

Hi,

Can any one help me in choosing Lg in a source degenerated LNA. Can I design complete Lg with the on chip spiral inductor? Or depending on the package I use, do I need to have the value of the inductance of the bond wire of the package? How do I simulate the bond wire inductance in cadence software?
 

bond wire inductance

Thanks for the reply. Do we need to model the bond wire based on the length and thickness of the bondwire used in the package? Any idea what are typical values of the bond wires in the 68 pin CQFP packages?
 

You can contact packaging house for an estimation of the bond wire parameters.
packaging houses like Amkor and Unisem will give you the basic parameters (but not the entire model) for the package you are using.
 

Status
Not open for further replies.

Similar threads

Part and Inventory Search

Welcome to EDABoard.com

Sponsor

Back
Top