Check my 6 layer stack up

[jeni_anto]

Is this 6 layer stackup good for doing reference designs based on wireless chipsets in the freq range of 1-3 Ghz.

TOP 0.05 mm copper foil+copper plating
DIELECTRIC 0.1016 mm 4 mil Core
LAY2 0.035 mm 1 oz Solid Ground
DIELECTRIC 0.1016 mm 4 mil PrePreg
LAY3 0.035 mm 1 oz Digital Signals
DIELECTRIC 0.3556 mm 14 mil Core
LAY4 0.035 mm 1 oz Digital Signals
DIELECTRIC 0.1016 mm 4 mil PrePreg
LAY5 0.035 mm 1 oz Power Plane
DIELECTRIC 0.1016 mm 4 mil Core
BOT 0.05 mm copper foil+copper plating Ground

Total 1.002 mm


FR4 Material used is ISOLA 370HR

 

[DavidReina]

6 layer stackup

I'm no an expert, but it looks good, I would recomend the FR408 though. if you are having 3GHz, I'm assuming you will have up to 6Gbps, so a low loss tan material would be better. hope it helps.

 

[Manikandan_S]

1 oz stackup mm

Hi
This stackup looks good...
For upto 3 GHz signals, we can use FR4 materials.

Manikandan

 

[chinta]

6 layer pcb stackup

This stackup looks good. For high speed you can use FR408 or Rogers material.