From my limited reading I make it that the EQ on
modern transmission line interfaces is meant to
idealize the far-end match, to maximally open
up the eye. Particularly as the physical plant
outside the IC, is unknown at time of chip
design / build / ship.
The effects of bond wires and leadframe are
more knowable and could be embedded to the
product electrical / physical design. This is the
norm for many RFIC functions, padding the
input wirebond with a little excess C to get
flat(-ish) 50 ohms Zpin in the advertised
working band.
Those parasitics are probably a nit, in the big
(end-to-end) picture, and might not see the EQ
step resolution to null them - but they are also
a minor fraction of the total, and don't deserve
nulling on their own (only as part of the whole)?