Bond pad - passivation layer?

[cheungw]

Hi,

Im a first timer EDA user. Im laying out bond pads for a 2x10 probe card. However, I don't know how to display the passivation opening in the bond pad. Im using cadence virtuoso and my process tech is 90nm. I'm open to any suggestion.

cheers

 

[Hughes]

You draw PAD layer like others layers. There should be a layer named PAD or something, you use it to draw rectangles (or squares) at the passivation opening positions.

 

[cheungw]

There doesn't exist a "PAD" layer as found in other technology libraries. Has anyone had similar experience when this has occured? what layer did u use for the passivation opening ?

willy

 

[Humungus]

Tell us what technology are you using and maybe somebody would have the same design kit.

 

[cheungw]

Im using CMOS090 (90 nm tech). Check out ST micro for info on design kit.

willy

 

[EcraZ]

The technology you use will give you a datasheet giving GDS numbers for various layers used to draw a layout and the color pallette / template will have these. As per the rules specified for laying out bondpads or probepads you have to draw the pads and have the necessary layers drawn as per rules.

 

[blueant]

Foundry can supply standard technology-file to you. If your technology-file do not define "PAD" layer, you should define it yourself base on foundry's info.

 

[tuza2000]

is the 90nm technology different from 180nm?

 

[kawaiicat]

yeah there may be different name according to the CAD supplier or foundry may provide the technology file for that, some may name as "cb" instead of "pad", some may use "glass", just check the gds, and the layer you can see from the layout tools, if they are the same, that's alright, as when you tapeout, no matter the layer name is useless, they check the gds no.

 

[yankuangtu]

you will have some PADS in the standard library,you can take it as reference...