Bga via

BGA Pad Pitch BGA Pad Opening (A) (mm) Solder Ball Diameter (B) (mm) RecommendedSMD Pad Size (mm) Recommended NSMD Pad Size (mm)









1.27 mm (Plastic Ball
Grid Array (PBGA))
0.60 0.75 0.60 0.51
1.27 mm (Super Ball Grid
Array (SBGA))
0.60 0.75 0.60 0.51
1.27 mm (Tape Ball Grid
Array (TBGA))
0.60 0.75 0.60 0.51
1.27 mm (flip-chip) (1) 0.65 0.75 0.65 0.55
1.00 mm (wirebond) (1) 0.45 0.63 0.45 0.38
1.00 mm (flip-chip) (1) 0.55 0.63 0.55 0.47
1.00 mm (flip-chip) (1)
APEX 20KE
0.60 0.65 0.60 0.51
0.80 mm UBGA (BT
Substrate)
0.4 0.55 0.4 0.34
0.80 mm UBGA
(EPC16U88)
0.4 0.45 0.4 0.34
0.50 mm MBGA 0.3 0.3 0.27