Mahruz
Junior Member level 3

Hi All,
I designed a 1.1GHz microstrip low pass filter using AWR.
After running axiem simulation, the results looks good. During the simulation, I used the following information which was provided from the PCB manufacturer.
Dielectric -3.5 (Rogers 4003)
Thickness -0.813mm
Top Copper- 1oz
Bottom Copper- 1 oz (this is polygon pour )
There is NO soldermask on the top copper trace.
There is soldermask on the bottom layer.
After manufacturing the design, the results was slightly shifted by nearly 200 MHz.
Is there any reason for this frequency shifts after manfucaturing despite the EM simulation shows excellent reason?
Thanks
I designed a 1.1GHz microstrip low pass filter using AWR.
After running axiem simulation, the results looks good. During the simulation, I used the following information which was provided from the PCB manufacturer.
Dielectric -3.5 (Rogers 4003)
Thickness -0.813mm
Top Copper- 1oz
Bottom Copper- 1 oz (this is polygon pour )
There is NO soldermask on the top copper trace.
There is soldermask on the bottom layer.
After manufacturing the design, the results was slightly shifted by nearly 200 MHz.
Is there any reason for this frequency shifts after manfucaturing despite the EM simulation shows excellent reason?
Thanks