[SOLVED] Altium: paste mask definition with via through pad

[samson41879]

Hello people from snowy Zagreb, Croatia. This is my first post here. Great community - keep going...

I have some questions regarding custom footprint design in Altium Designer 10.

You will find below a picture of FAKRA high speed connector footprint. I made the picture in Top Paste layer just for you to see where are the pads which are on a top layer.

1. Solder paste has to be printed into vias as well as on the pads. How I define that in Altium Designer?

2. Can I put the pads on the copper fill or pads have to be extensions of the copper fill?

3. Do you have some other advices or you see that I am doing something wrong based on the recommended footprint from the datasheet (see above link)?

Thank you very much for your time!

Best Regards!

 

[anilrock87]

hi,

1)You can do this by enabling or selecting the particular layer say top paste and draw the required shape by placing primitives from 'place' .

2)yes

3)instead of placing via place PAD

 

[samson41879]

Thank you for help!