Adding Bonding PAD in encounter

[dr.farnsworth]

bonding pad add

Hello,
Could you please give some info, how bonding pads are added in encounter, i found how IO cells are placed using the io file. i was sucessful in placing IOCells,
but how to add Bonding Pads ??

Please help..

Regards,
Dr.farnsworth

 

[eminem198123]

encounter pin io file

Dear farnsworth:

You should use multi-row IO in encounter, I will show you the exact use!

The following syntax of I/O Assignment File allows you to create multiple I/O rows:

RowMargin: side <rowNumber> <offset>
Row: <rowNumber>
Indent: <length>

"RowMargin" specifies the I/O pad row margin, measuring from the die box inward, rather then
from the core box outward.
"side" Assigns a pin to the specified side of the design. Specify n (north), w(west),
s(south),or e(east).
"rowNumber" parameter specifies the row number, counting inward from the outer edge of the design.
"length" Indents the next pad or pin by the specified distance from the I/O pad row
determined by RowMargin.

Below example explains how to achieve double IO row:

........
Version: 2
RowMargin: s 1 0
RowMargin: s 2 200
RowMargin: w 2 300
RowMargin: e 2 400
Pad: c1 SW
Pad: c2 SE
Row: 1
Pad: pad1 s
Row: 2
Pad: pad2 s
Row: 1
Pad: pad3 s
Row: 2
Indent: 400
Pad: pad4 s
Row: 2
Pad: pad5 s
Pad: pad6 s
Pad: pad7 s
.........

The floorplan should like:

-----------------------------------------------
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| ---------------- |
|<---300--->|p2|p4|p5|p6|p7|<-----400--------->|row 2
|------------x--------x------------------------|
| | | | | | | | |
| c1 |<---x-->|p1 | 200 |P3 |<----x--->| c2 |row 1
| | | | | | | | |
------x-----------------------------------------
<---x---->
Note: The entire row area is distributed equally among the available IO Pad cell in that
row, such that they are placed at equidistance to each other.

 

[dr.farnsworth]

bonding pad

thanks eminem198123 for the reply..

But the way you have described IO cells are added and may not be Bonding PAD in encounter..
i guess this terms little confusing whether we are talking abt IO Cells or Pad cells (Bonding Pad)

I have already added IOCells (which are also called IO PAD cells in the documentation)