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Pad Peel off strength of components from footprint

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Rame

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Hi Folks,

I need information for the Pad Peel Off for the SMT Components from the Foot print,What are the parameters one has to look into....

Someone please refer links or send across some details regarding that.

Thanx in Advance.


Regards

Ramesh
 

RAME,

You should always refer to datasheets, follow the recomended land patterns.

There are different thumb rule, one of such is (pad size 10% bigger,soldermask 20% bigger & paste mask 10% smaller) w.r.t actual pattern. This rule of them might differ from designer to designer or industry to industry.

People who design PCB's for automobile application prefer bigger land pattern & thick traces. That's my experience.

Good Luck
 

hi
i think we got some formulae with regard to this size calculations.i came across them in this forum only.have a quick search of old posts.

gud luck
 

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