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As far as I know, placement of most BGA packages are easier than those of fine pitch QFP Packages. The reason is, during the reflow phase, when the balls start to melt, the package self alignes itself compansating for small missaligments, due to surface tension created by melting balls. But this may not be case for fine pitch BGA packages. Most of the problems with BGA packages arise due to poor soldering of some pads or solder bridges between pads. These problems are mostly related to the manufacturing process.
regards
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