maker8122
Junior Member level 1
A stepper driver (TMC5130) is mounted on a 4 layer PCB with thermal vias under the part.
The bottom layer is a GND plane.
The PCB is mounted on a machined aluminium block that carries various mechanical parts and effectively forms a part of the chassis.
I'd like to machine the aluminium block so that a short column contacts the underside of the thermal pad, thereby effectively drawing away the heat. Am considering machining the column so that it is 0.1mm taller than the PCB standoffs and then relying upon the elasticity of the PCB to assure contact.
Are there best practices to observe for such a setup?
And what about the electrical perspective? Am concerned about making unplanned electrical contact between the ground plane and the chassis where the aluminium block touches the thermal vias (GND plane).
Any suggestions most welcome.
The bottom layer is a GND plane.
The PCB is mounted on a machined aluminium block that carries various mechanical parts and effectively forms a part of the chassis.
I'd like to machine the aluminium block so that a short column contacts the underside of the thermal pad, thereby effectively drawing away the heat. Am considering machining the column so that it is 0.1mm taller than the PCB standoffs and then relying upon the elasticity of the PCB to assure contact.
Are there best practices to observe for such a setup?
And what about the electrical perspective? Am concerned about making unplanned electrical contact between the ground plane and the chassis where the aluminium block touches the thermal vias (GND plane).
Any suggestions most welcome.