CataM
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Hello everyone,
I am planning to use BSC117N08NS5 which is in a SuperSO8 package.
Max power it will dissipate is 1 W and I want heatsinking via PCB itself (PCB horizontal position). I see that Rth(ja)=50 K/W at 6cm^2 area.
I want to allow Tjunction=100ºC in a 25ºC ambient, so Rth(ja)max allowed is 75 K/W.
My question is, how do I know how the area influences the thermal junction-to-ambient resistance ? Is it a linear relationship ? Anyone can provide some docummentation/explanation ?
Thank you for your time !
I am planning to use BSC117N08NS5 which is in a SuperSO8 package.
Max power it will dissipate is 1 W and I want heatsinking via PCB itself (PCB horizontal position). I see that Rth(ja)=50 K/W at 6cm^2 area.
I want to allow Tjunction=100ºC in a 25ºC ambient, so Rth(ja)max allowed is 75 K/W.
My question is, how do I know how the area influences the thermal junction-to-ambient resistance ? Is it a linear relationship ? Anyone can provide some docummentation/explanation ?
Thank you for your time !