Welcome to our site! EDAboard.com is an international Electronics Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.
its very simple, select any layer which is free draw the shape of via, like rectangle to make box kind of via, circle to make cylinder kind of via, stright line to make planar via, (it is automatically extruded in to 3D by software), now go to subsrate create/modify, click layout layers tab, click the substrate layer in via you want to punch via, then on right you will find the drop down menu select the layer on which you made the shape of via, and click the button "via" which appear above apply button, thats it
This site uses cookies to help personalise content, tailor your experience and to keep you logged in if you register.
By continuing to use this site, you are consenting to our use of cookies.
