Continue to Site

Welcome to EDAboard.com

Welcome to our site! EDAboard.com is an international Electronics Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.

Register Log in

Difference between Pins, Pads, Bond Pads in layout

Status
Not open for further replies.
H

hb_cancer

Member level 2
Joined
Jul 25, 2005
Messages
44
Helped
1
Reputation
2
Reaction score
0
Trophy points
1,286
Activity points
1,596
Hi All,

I want to know whats the difference between a Pin, Pad and Bondpad in layouts in general, It would be really helpful if there are any screen shots to supplement.
 

Hi,

Pads means means interface logic between chip and external environment,,it involves ESD ckt,
Buffer circuits other protection ckts.

Bond pads means the place in Pads which we can take wires from die to packaging..

Pins menas lead material which are coming out of packages.
 
Status
Not open for further replies.

Similar threads

Part and Inventory Search

Welcome to EDABoard.com

Sponsor

Back
Top