Continue to Site

Welcome to EDAboard.com

Welcome to our site! EDAboard.com is an international Electronics Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.

Register Log in

help,how to add bonding pad in soce

Status
Not open for further replies.
L

lightcloud

Member level 4
Joined
Oct 20, 2005
Messages
71
Helped
0
Reputation
0
Reaction score
0
Trophy points
1,286
Activity points
1,812
Hi,
I want to know how to add bonding pad in soc encounter

thanks a lot!
 

you need to do some scripting for that. first you need to add bondpad in your design , then place it at proper place. use following commands

addinst -cell <master_cell_name> -loc <X> <Y> -inst <inst_name>
placeInstance <inst_name> <X> <Y> <orientation> -fixed

this will work.
 

Hi,
What you mean by BONDPAD????
 

Hi,
Bonding pad is used to connect io pad to package pin. and when I used
the method in soc encounter,after doing verification, I find very lot overlap
and short violation between io pad and bonding pad.shoud I check it?
and how to decide the oritentaion of the bonding pad?

thanks a lot!

Added after 2 minutes:

Hi,
I want to if it appear new drc vioalion after add the bonding pad?
 

Status
Not open for further replies.

Similar threads

Part and Inventory Search

Welcome to EDABoard.com

Sponsor

Back
Top