reshaping
Newbie level 1
I have a doubt regarding package model assignment
associated with multi board analysis
I have attached package model for both the connectors, connecting between
boards with no buffer models assigned to them . I am not able to differentiate
variation in the results with package models (eventhough I have changed the
C_pkg to higher valus). I afraid the package parasitics is not included in my
analysis
Does anyone has worked on these kind of simulation ?
associated with multi board analysis
I have attached package model for both the connectors, connecting between
boards with no buffer models assigned to them . I am not able to differentiate
variation in the results with package models (eventhough I have changed the
C_pkg to higher valus). I afraid the package parasitics is not included in my
analysis
Does anyone has worked on these kind of simulation ?