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I have never seen aluminum ball bonding, only "wedge".
Probably due to aluminum ductility (lesser) preventing
the "coining" that a gold ball will see.
Inductance is probably not the issue (given equal
length and near equal diameter) but resistance may
be.
Your choice of bond wire may be more about other
things in the end, such as bond pad top layer
composition, product assembly and application
temperatures (e.g. intermetallic compounds on
an Au-wire, Al-pad assembly causing unreliable
bond wire adhesion) or what can be had as a
qualified assembly flow at the shop you end up
told to use.
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