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Bulk fixing (gluing) CMOS

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lufer17

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Hello everyone I'm having trouble finding the material that talks about CMOS regarding bulk fixation. I know that the bulk is welded in well n (n-well) or well p (p-well) depending on its structure, because it is welded, because it is more doped so the flow of electrons is easier this way a behavior metallic. But I can't find material that specifically talks about this in a book or booklet or a reliable website in the academic area. I would like a material that talks about it.

I do not know if it is a translation error that I am making of the following words, gluing, welding, fixing, nailing.


bulk.png
 

I think you're looking for things like "body tie",
"substrate tap", "well tap" and possibly die attach
and backside grind (if you intend to contact the
handle that way).
 

"gluing, welding, fixing, nailing" are the wrong terms, to describe substrate / wells.

Electric properties of the wells are determined by the their impurity doping profiles, defined by ion implantation and subsequent process steps (diffusion, oxidation, etc.).

The doping profiles determine wells conductivity, and define p-n junctions or diodes.
 

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