Equivalent circuit for package lead

I'm working on a project in which I need to calculate parasitic elements for ceramic DIP package and then build model in circuit simulator.

What does the equivalent circuit for package lead look like? Can I just measure the resistance and inductance between pad and pin and use this values in simulator?

Hi,

TI has this app note with three package lead models:

snoa405a/AN-1205 Electrical Performance of Packages

And this Google search brought up a variety of interesting looking articles and documents you could check out: ic package lead model

Can I just measure the resistance and inductance between pad and pin and use this values in simulator?

Click to expand...

If you have the respective instruments and suitable test fixtures, and experience to use it, you can "just" measure it. I guess, you can't.

It's more promising to estimate parasitic package elements by simple physically based models. Package models are also included with some manufacturer SPICE models.

Individual leads and bond wires are easy. You can
get bond wire R, L off the Web. Package materials
strongly affect trace resistance (is your ceramic
package using plain tungsten (most common),
molybdenum (less common, slightly better R)
of copper-tungsten (rare as a fired trace though
common as a mechanical layer; I've designed
high power flatpacks with a Cu-W base instead
of aluminum).

You can get 4-point resistance with a good DMM
or two ordinary ones and a power supply. You
can figure inductance is unaffected by materials
and call it 1nH/mm.

Where it gets difficult, and sometimes important,
is the mutual inductances and mutual capacitances.
For that you might look at an EM simulator if you
can get the 2D package trace layout to build the
3D mesh from. This is what RFIC outfits have to
do all the time. You might check out RF packaging
papers for clues about how, and what tools to use
or avoid. A steep learning curve awaits.