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Factors deciding Silicon Wafer Thickness

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Vishu21_95

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Hi,
I want to know 'what are the factors which decide the thickness of silicon wafer which will be used as a substrate?'
Thanks.
 

1. The wafer diameter (crash (concussion) safety during handling (manual or automatic) )

2. The dice' separation method (scribe & break, sawing, etching)

3. As thin as possible (silicon usage)
 
Thinning (EOL) is needed more than before, for some of
the low profile packaging that's become popular (not to
mention 2.5D/3D integration). People are also doing
extreme thinning to get flexible silicon. I see many ICs
now on boards, that are thinner than the 11 mils we
used to grind to in production.

The substrate starting thickness (BOL) is another matter,
you generally would take something your starting material
vendor has good pricing, availability for and something
your tool-chain's various elements have no problem
holding.

High voltage devices will have thicker starting material
than your low voltage logic, to accommodate the deep
depletion spread.
 
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