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  1. #1
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    Factors deciding Silicon Wafer Thickness

    Hi,
    I want to know 'what are the factors which decide the thickness of silicon wafer which will be used as a substrate?'
    Thanks.

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  2. #2
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    Re: Factors deciding Silicon Wafer Thickness

    1. The wafer diameter (crash (concussion) safety during handling (manual or automatic) )

    2. The dice' separation method (scribe & break, sawing, etching)

    3. As thin as possible (silicon usage)


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  3. #3
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    Re: Factors deciding Silicon Wafer Thickness

    Thinning (EOL) is needed more than before, for some of
    the low profile packaging that's become popular (not to
    mention 2.5D/3D integration). People are also doing
    extreme thinning to get flexible silicon. I see many ICs
    now on boards, that are thinner than the 11 mils we
    used to grind to in production.

    The substrate starting thickness (BOL) is another matter,
    you generally would take something your starting material
    vendor has good pricing, availability for and something
    your tool-chain's various elements have no problem
    holding.

    High voltage devices will have thicker starting material
    than your low voltage logic, to accommodate the deep
    depletion spread.


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