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  1. #1
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    Environmental testing of Unit inside Chamber

    Environment Test
    Part Numbers Used:
    RAM : MT48LC16M16A2TG-6A:GTR
    MCU: LPC1788FBD208


    Day 1: Cold Cycle Test
    Entire unit( PCB Board fitted inside the casing ) is kept in a chamber and following tests are performed.
    step 1: Chamber Temperature is Brought down From Ambient temperature to -5째C(Takes about 30 Min)
    step 2: It is maintained at -5째C for 2 Hours
    Step 3 : Now the unit is turned ON for 2 Hours.
    Step 4: Now the temperature is brought down from -5째C to 0째C and unit is kept in OFF condition for 2 Hours
    Step 5 : Now the unit is turned ON for 2 Hours.

    Day 2: Dry heat Test
    Step 1: Chamber Temperature is Brought up From Ambient temperature to +55째C(Takes about 35 Min).
    Step 2: At +55째C , unit is turned ON for 2 Hours and kept OFF for 2 Hours
    Step 3 : At +50째C, Unit is turned ON for 2 Hours and kept OFF for 2 Hours
    Step 4 :Chamber Temperature is bought down to ambient Temperature (Unit is in OFF condition)

    Day 3 : Damp Heat Steady State
    Step 1 : At +40째C, 95%Rh , Unit is Kept in OFF Condition for 24 hours.
    Step 2 : Just 5 Minutes Before completing 24 hours, unit is Turned ON, check for its proper functioning and then turned OFF. While performing Step 2, Unit Failed to turn ON.

    NOTE : In The Program Initialization, Step for turning ON the unit comes after initializing MCU , RAM.

    While Debugging, MCU was initialized, RAM was not functioning.
    Hand solder touch-up was done to RAM on PCB, Unit was switched ON and was functioning accordingly.
    Unit was put in chamber again and Environment Tests were followed up.
    Again While performing Step 2 on Day 3, Unit Failed to turn ON.
    While Debugging, MCU was initialized, RAM was not functioning.
    Hand solder touch-up was done to RAM on PCB, Unit was switched ON and was not functioning.
    For Checking RAM, on all Data lines, Read and Write was performed (data bits consisted of alternate 1's and 0's).
    Using CRO, On all data pins of both RAM IC's , wave-forms were Appearing as in Fig 1, Except on one of the data pin of 2nd RAM IC, wave-forms appeared as in Fig 2(Controller side waveform was proper, RAM pin waveform was different).
    I replaced the 2nd RAM IC, on which wave-forms were appearing as in Fig 2. Unit Started functioning properly.
    What would be the cause for such issues ? Should i Consider a different part number for RAM ?
    Will there be any issue with PCB design ?

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  2. #2
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    Re: Environmental testing of Unit inside Chamber

    It could a faulty components but the environmental conditions are not particularly harsh.
    Can you show a schematic, obviously something is between the MCU and RAM if the signals are different between them.
    Why was the solder touch up needed?

    My first suspicion in a case like this is the handing during touch-up has caused the damage.

    Brian.
    PLEASE - no friends requests or private emails, I simply don't have time to reply to them all.
    It's better to share your questions and answers on Edaboard so we can all benefit from each others experiences.



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  3. #3
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    Re: Environmental testing of Unit inside Chamber

    Schematic is split into pages,but Signals are coming directly from MCU to the RAM. There is nothing in between.



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  4. #4
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    Re: Environmental testing of Unit inside Chamber

    are the ICs all speced to work properly at at least the conditions of your test?

    was there any condensation at 40 deg C and 95% RH?
    does the humidity come up first, or does the temperature come up first?

    if the humidity comes up first, there may have been hidden condensation that did not
    bake out in the high humidity

    if there was any condensation, all kinds of things could happen
    is your board conformal coated ("painted" with a clear ?? to keep moisture and dirt off the circuits) or not?



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